Specifications | · Wafer Size: 4" diameter x 0.5mm · Si wafer Orientation: (100) + / - 0.5o · Insulating Layer: SiO2 · Diamond film thickness: 2 micron; Oxide Layer: 1 micron · Resistivity: <0.1 >0.1 > · Surface Roughness: as grown, RA < 10=""> · Package: One 1000 class clean room with 100 class plastic bag |
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