·         Film Deposition by DC Sputtering 

·         Silver Thickness: 0.2 microns

·         Film Resistivity: N/A

·         Film Crystallinity:  N/A

·         Roughness, RMS:  4.87 nm and  < 10="">

·         Conductive type:        Si   P- type,B-doped 

·         Resistivity:                  1-20ohm-cm

·         Size:                          4" diameter +/- 0.5 mm  x 0.525 +/- 0.025 mm th

·         Orientation:                (100) +/- 0.5^o

·         Polish:                        One  sides  polished

·         Surface roughness:     Prime

·         Packing:                      Vacuum packed on a 4" single wafer carrier

Optional:  you may need tool below to handle the wafer ( click picture to order )