晶圓擴(kuò)膜機(jī) （Wafer Expander）性能及特點(diǎn)為：
很均勻的擴(kuò)張已切割或破裂的晶圓，使它能達(dá)到所需晶粒的距離，然后改善切割后的制程及晶粒的處理
Uniformly expands diced and 1 or fractured wafers to produce the required die interval .Signilicantly improves post-dicing chip/die handing.
特點(diǎn)：
1. 有不同種的擴(kuò)張比率.
2. 可調(diào)整的擴(kuò)張速度.
3. 配備溫度擴(kuò)張臺(tái).
4. 擴(kuò)張膠膜及晶圓可自動(dòng)被固定的.
5. 擴(kuò)張夾具為樹脂銹花圈或環(huán)狀?yuàn)A緊物,由內(nèi)圈和外圈組成,可自動(dòng)夾緊被擴(kuò)張的晶圓和膠膜.
6. 簡單的機(jī)械裝置,免維修的設(shè)計(jì).
Features：
1. Expansion ratio can be freely varied.
2. Expansion speed is also variable.
3. Equipped with a heated expansion stage
4. Expanded film / wafer can be griped automatically.
Features：
1. Expansion ratio can be freely varied.
2. Expansion speed is also variable.
3. Equipped with a heated expansion stage
4. Expanded film / wafer can be griped automatically.
5. Resin double rings / grip rings the expansion jig consisting of inner and outer ones for automatic grips of expanded wafer / film.
6. Simple mechanism maintenance-free design.
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