Omniprobe 聚焦離子束載網(wǎng)FIB半分載網(wǎng) Lift-Out Grids
Omniprobe聚焦離子束載網(wǎng)專為聚焦離子束切割儀或聚焦離子束/透射電鏡系統(tǒng)的電鏡切片準備。載網(wǎng)的典型厚度為25-30um,直徑3mm。
Omniprobe 聚焦離子束載網(wǎng)FIB半分載網(wǎng) Lift-Out Grids
Omniprobe聚焦離子束載網(wǎng)專為聚焦離子束切割儀或聚焦離子束/透射電鏡系統(tǒng)的電鏡切片準備。載網(wǎng)的典型厚度為25-30um,直徑3mm。中間的小柱設計用來保持蕞佳的接觸和為片層樣品粘附(焊接)提供安全區(qū)域。這些聚焦離子束載網(wǎng)適合于標準的透射電鏡載網(wǎng)夾并且可以直觀的看到粘附于小柱的剖面。
載網(wǎng)主要應用于離子刻蝕。在離子束下不干擾EDS的X射線峰,對樣品可起到良好的保護作用。
The Omniprobe® Lift-Out Grids are specifically designed to accept the TEM lamellas milled out by FIB or SEM/FIB systems. Typical thickness of the grids is 25-30µm with a diameter of 3mm. The posts are designed for optimum access and provide a secure area for attaching (welding) the lamella(s). The Omniprobe grids fit standard TEM holders and provide a non-obscured view of the thin sections attached to the posts.
Omniprobe 聚焦離子束載網(wǎng)FIB半分載網(wǎng) Lift-Out Grids
Description | Unit |
Omniprobe Lift-Out Grids, Cu with 3 posts | pkg/100 |
Omniprobe Lift-Out Grids, Cu with 3 posts, shallow downset | pkg/100 |
Omniprobe Lift-Out Grids, Mo with 3 posts | pkg/25 |
Omniprobe Lift-Out Grids, Cu with 3 posts and side access | pkg/100 |
Omniprobe Lift-Out Grids, Cu with 4 posts | pkg/100 |
Omniprobe Lift-Out Grids, Mo with 4 posts | pkg/25 |
Omniprobe Lift-Out Grids, Cu with 5 posts | pkg/100 |
Omniprobe Beryllium Half Ring Grids, Be | pkg/10 |
GSB-100 Storage Box for 100 Omniprobe grids, complete with base, lid and clips | each |