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 PELCO® High Performance Silver Paste 高效銀導(dǎo)電膠

高效銀導(dǎo)電膠

PELCO® High Performance Silver Paste 高效銀導(dǎo)電膠
置于無機(jī)硅酸鹽溶液中的片狀銀粉專門為了滿足以下一些情況下的粘合應(yīng)用:

高溫高至攝氏927度（華氏1700度）

高真空-無碳?xì)浠衔?無揮發(fā)性有機(jī)化合物

低溫（適宜性依匹配性能而定）

導(dǎo)熱和導(dǎo)電性能，另外加上不含有碳?xì)浠衔?，使得該產(chǎn)品成為理想的掃描電鏡、x射線光電子分光鏡、化學(xué)分析電子光譜、次級離子質(zhì)譜、鉆孔機(jī)以及其他應(yīng)用制作符合要求的樣品的選擇。PELCO高效銀漿的銀粒尺寸為20um，同時提供高效的熱傳導(dǎo)性和電導(dǎo)性。銀含量超過60%。室溫下可以固化，但是需要在攝氏93度（華氏200度）固化2小時以獲得高的傳導(dǎo)能力和強(qiáng)的粘附性。

PELCO® High Performance Silver Paste 高效銀導(dǎo)電膠

The excellent thermal and electrical conductivity, coupled with the absence of hydrocarbons, makes this product ideal for demanding specimen preparation in FESEM, XPS, ESCA, SIMS, Auger and other applications. PELCO^® High Performance Silver Paste provides both high and thermal conductivity with a silver particle size of 20µm. Silver content >60% by weight. Cures at room temperature, but requires a 2 hour cure at 93°C （200°F） to achieve high conductivity and strong bond. Must be fully cured before using this product at cryogenic temperatures. Soluble in water to 260°C （500°F）. Above this temperature it becomes almost insoluble.
PELCO® High Performance Silver Paste, 50g