1. 消除基材表面靜電,清潔活化基材表面,提高基材表面能,提升黏膠于基材的附著力。
Eliminate static electricity on the substrate ,clean the surface of the activated substrate ,improve the surface energy of the substrate ,and improve the adhesion of the adhesive to the substrate.
2. 等離子溫度低,不損傷基材
The plasma temperature is low and does not damage the substrae.
3. 不產(chǎn)生電弧,不損傷被處理產(chǎn)品的芯片
No arcing,no damage to the chip of the processed product.
機器尺寸 Machine size | 1250*650*1350 L*W*H(特殊尺寸可定制) |
工作臺尺寸 Word table size | 400*550mm |
工作尺寸 Max word table size | 350*450mm |
機器重量 Machine weight | 約350KG |
電壓/功率 Voltage/power | 220V/1.5KW |
傳動系統(tǒng) Drive system | 伺服控制系統(tǒng) Modular servo control system |
傳動部件 Transmission parts | 絲桿 Ball screw |
移動速度 Moving speed | 1-800mm/sec |
控制系統(tǒng) Control system | 工控主機 Industrial computer |
操作界面 Operation interface | VECTRON control software |
異常報警功能 Error Alarm | 是 Yes |
空氣凈化系統(tǒng) Air Fliter System | 選配 Optional |
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