適用于藍(lán)寶石/玻璃/陶瓷的精密切割,FPC/PCB板的精密切割與鉆孔,各類金屬與非金屬薄板的精密切割
Suitable for Sapphire / glass / ceramic precision cutting, FPC / PCB precision cutting and drilling, and all kinds of metal and non-metal thin sheet precision cutting
可配置355nm紫外激光，532nm綠激光，1064nm納秒激光與1064nm皮秒激光，滿足不同材料和不同加工工藝的需求355nm UV laser, 532nm green laser, 1064nm nanosecond laser and 1064nm picosecond laser can be configured to meet the needs of different materials and different processing technologies
采用全封閉式設(shè)計，保證加工過程中的人員安全
Fully closure cabinet ensures the safety of operator during laser processing
大理石基座配備直線電機(jī)和CCD定位，確保XY軸±2um的定位精度
Marble base equipped with linear motor and CCD positioning to ensure positioning accuracy of XY axis ±2um
搭載掃描頭，速度高達(dá)8000mm/s，實(shí)現(xiàn)高產(chǎn)能
Scanning peed up to 8000mm / s, which will realize high production capacity
開放性接口設(shè)計，可通過二次開發(fā)或其硬件拓展?jié)M足各類自動化需求Open interface can meet all kinds of automation requirements through secondary development or hardware expansion
| 設(shè)備機(jī)型Model No. | CY-JC系列 | |
| 激光功率Laser Power | Optional | |
| 激光模式Laser Mode | Optional | |
| 激光波長Laser wavelength | 355nm/532nm/1064nm/10600nm Optional | |
| 加工范圍Processing Scale | 600*500mm/300*300mm | |
| 加工速度Processing Speed | 固定出光fixed laser output:1~800mm/s; 掃描出光scanning laser output: 30~8000mm/s | |
| 冷卻方式Cooling Type | 風(fēng)冷或水冷air cooling or water cooling | |
| 供電電源Power Supply | 單相AC220V 15A single phase | |
| 保護(hù)氣體Shield Gas | 氮?dú)釴itrogen/氬氣Argon/二氧化碳CO2/空氣compressed air | |
| 整機(jī)耗電Power Consumption | <1.5KW | |
| 外型尺寸Outer Dimensions | 1800*1750*1810mm or1500*1700*1500mm | |
| 環(huán)境要求Work Environment | 溫度Temperature 10℃`35℃,濕度Humidity 5%~75% | |
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