功能特點FEATURES：
1. 消除基材表面靜電，清潔活化基材表面，提高基材表面能，提升黏膠于基材的附著力。
Eliminate static electricity on the substrate ,clean the surface of the activated substrate ,improve the surface energy of the substrate ,ａnd improve the adhesion of the adhesive to the substrate.
2. 等離子溫度低，不損傷基材
The plasma temperature is low and does not damage the substrae.
3. 不產(chǎn)生電弧，不損傷被處理產(chǎn)品的芯片
No arcing,no damage to the chip of the processed product.

設備參數(shù)： PARAMATER

輸入電壓 Input Voltage	VAC	220±10% Single Phase
輸入電源頻率Input Frequency	HZ	50/60
輸入電流InputCurrent	AMP	Max 8per a head
接地電阻值Ground Resistance	Ω	Lower than 10
輸入氣體Input Gas	NA	AIR(CDA),CO2,N2,Ar,eTC
輸入氣壓Gas Pressure	MPA	0.4～0.6
輸入氣體流量GasFlow Rate	LPM	25～28
等離子功率Plasma Output	WATT	500/1000/1500
放電電壓Discharge Voltage	KVOLT	8～12
放電頻率Discharge Freq	KHZ	30～60
噴頭轉(zhuǎn)速Plasma Revolution	RPM	1200～3000
噴嘴長度Plasma Length	MM	Max.70
噴嘴幅寬Plasma Width	MM	20/40/60/80/100/150
噴嘴溫度Operation Ambient Temp	℃	50
噴頭數(shù)量Discharge Head Quilty	SET	1	2
噴頭長度Discharge Head Length	METER	Max 8per a head